{"product_id":"book-9784910558554","title":"半導体実装技術の基礎と応用 : 高集積化・高機能化を実現するマイクロ接合・評価・解析 \/ Handoutai Jissougijutsu No Kiso To Ouyou Koushuusekika Koukinouka Wo Jitsugen Suru Maikuro Setsugou Hyouka Kaiseki","description":"\u003cp\u003e\u003cstrong\u003e著者:\u003c\/strong\u003e 巽,宏平 (Tatsumi , Kouhei)\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e出版社:\u003c\/strong\u003e 科学情報出版 (Kagakujouhou Shuppan)\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eISBN-13:\u003c\/strong\u003e 9784910558554 \u003cstrong\u003eISBN-10:\u003c\/strong\u003e 4910558551\u003c\/p\u003e\u003cp\u003e発売日: 202604\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e","brand":"科学情報出版","offers":[{"title":"Default Title","offer_id":55135387582743,"sku":"9784910558554","price":8223.0,"currency_code":"JPY","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1027\/0910\/0823\/files\/9784910558554_1_3.jpg?v=1792315688","url":"https:\/\/ninjapanbooks.com\/products\/book-9784910558554","provider":"NINJAPAN BOOKSTORE","version":"1.0","type":"link"}